HycoFusion® Technology for Hybrid Profiles

Lighter constructions. Higher performance. Lower CO₂ footprint.

HycoFusion® combines specially developed wooden cores with closed aluminium or steel profiles. The patented joining process uses the controlled swelling of the wood to generate full-surface contact pressure and thus a mechanically effective connection between wood and metal. As a result, the wooden core becomes a structurally active component of the hybrid profile.

The connection requires no adhesives and is reversible: at the end of their service life, the materials can be separated again and returned to their respective material cycles.

Our hybrid solution:

Reduced material use

Wood as a renewable raw material

Fully recyclable

Shear-resistant and reversible connection without adhesives

Our hybrid solution:

Reduced
material use

Wood as a
renewable raw
material

Fully
recyclable

Shear-resistant and reversible connection without adhesives

Properties & advantages of the technology

Property
Technical Value
Your Benefit
Metal Savings
Up to 50%* metal savings
Lighter structures, reduced energy consumption in operation
Higher Stiffness
Up to 180% increase in stiffness compared with the reference aluminium profile
Thinner profiles, greater design freedom
Energy Absorption
Up to 235% increase in energy absorption compared with the reference aluminium profile
Superior crash performance, greater safety
Acoustic Damping
Significantly reduced structure-borne sound transmission
Comfort & noise reduction in vehicles and buildings
Reversible Joining
Adhesive-free, separable without special tools
Reversibly joined and separable into individual material streams, circular economy

*depending on application, profile geometry, metal content and reference construction.

Intellectual property rights

The HycoFusion® technology and its reversible joining process are protected by an international patent family. Hycobility is continuously expanding the protection of the technology through further patent applications and intellectual property rights.

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